AGP Wire
Stay informed with articles highlighting the latest developments, major events, and essential updates.
Electrical and electronics materials market to reach $4.92 billion by 2030
AGP
The electrical and electronics materials market is projected to grow from $3.02 billion in 2025 to $4.92 billion by 2030, driven by semiconductor demand, advanced PCB substrates, EV adoption and sustainable materials innovation.
Electroninks launches UV-curable silver ink for printed electronics and EMI shielding
AGP
Electroninks on June 15 launched EI-1169, a UV-curable silver conductive ink for inkjet printing across advanced electronics manufacturing.
Upper Shell touts intelligent ceramic manufacturing line for electronics makers
AGP
Upper Shell unveiled advanced intelligent ceramic manufacturing solutions aimed at helping electronics producers make LTCC and MLCC components with more automation, precision and consistency.
NovaCentrix launches platinum conductive ink for precision printed electronics
AGP
NovaCentrix on June 11, 2026 introduced Metalon JPT-710UA-P, an aqueous platinum nanoparticle aerosol ink designed for high-resolution printing with the IDS NanoJet system.
Consumer electronics e-commerce market stays fragmented as Amazon leads
AGP
The consumer electronics e-commerce market remains highly fragmented, with Amazon.com Inc. holding the biggest share in 2024 and the top 10 players controlling just 7% of revenue.
Venture Electronics touts vacuum nitrogen reflow for leaded soldering
AGP
Venture Electronics says its leaded nitrogen vacuum reflow soldering process is built to cut voids, reduce oxidation and improve reliability for aerospace, medical, defense and other high-reliability electronics.
Venture Electronics showcases medical PCB prototyping at CIECE
AGP
Venture Electronics Tech Ltd. used the Shenzhen International Electronics Circuit Exhibition to highlight PCB assembly prototyping for medical devices, including rapid turnaround, validation steps and micro-assembly capabilities.
Venture Electronics pushes aqueous cleaning for leaded PCB assemblies
AGP
Venture Electronics is promoting aqueous, water-based cleaning for leaded PCBAs as a safer alternative to solvent and ultrasonic methods, especially for automotive and medical electronics.
Venture Electronics pitches high-mix, low-volume PCB assembly for complex builds
AGP
Venture Electronics Tech Ltd. is highlighting a manufacturing model built for low-volume, high-complexity PCB assembly in Shenzhen, with services aimed at industrial, medical and aerospace projects.
Venture Electronics expands PCBA conformal coating services for harsh environments
AGP
Venture Electronics Tech Ltd. is pitching its Shenzhen-based PCBA conformal coating services as a way to protect electronics from moisture, dust, chemicals and thermal stress.
Venture Electronics showcases PCB reverse engineering at PCB West
AGP
Venture Electronics Tech Ltd. is highlighting its PCB reverse engineering services at PCB West in Santa Clara, positioning the work as a way to restore obsolete hardware, improve legacy designs and support production-ready documentation.
IntelliDesign wins Redback electronics contract from Hanwha Defence Australia
AGP
IntelliDesign has landed a contract to supply complex electronic assemblies for Hanwha Defence Australia’s AS21 Redback infantry fighting vehicle program under LAND 400 Phase 3. The work expands Australian manufacturing capacity for a major Army…
Leader Micro Electronics updates micro coin vibration motors for thinner devices
AGP
Leader Micro Electronics says it has optimized its ERM pancake motors to help OEMs fit reliable haptics into ultra-thin wearables and portable medical devices.
Venture Electronics pitches low-volume PCB assembly for niche markets
AGP
Venture Electronics Tech Ltd. says its low-volume ODM PCB assembly services are aimed at niche sectors that need high-reliability manufacturing without large minimum orders.
Venture Electronics pitches certified prototype PCB assembly for faster hardware development
AGP
Venture Electronics Tech Ltd. says its Shenzhen operation is built to speed prototype PCB assembly for hardware teams that need low-volume, high-complexity production with traceability and compliance.
Venture Electronics to showcase box build assembly at CPCA Show
AGP
Venture Electronics Tech Ltd. is using the CPCA Show in Shenzhen to pitch itself as a box build assembly partner for industrial, medical and aerospace electronics.
Venture Electronics pitches turnkey PCB assembly as a lower-risk alternative to consigned builds
AGP
Venture Electronics Tech Ltd. argues that market leaders should choose turnkey PCB assembly over consigned manufacturing to reduce supply-chain risk, speed prototyping and improve quality control.
Venture Electronics spotlights high-reliability manufacturing at Electronica
AGP
Venture Electronics is using Electronica in Shenzhen to pitch China-based electronics manufacturing services for industrial, automotive, energy and aerospace customers.
Venture Electronics highlights high-reliability EMS capabilities in Shenzhen
AGP
Venture Electronics Tech Ltd. is pitching itself as a Shenzhen-based electronics manufacturing services provider for industrial, automotive, aerospace, military and medical hardware.
Bluetooth 5.0 market seen reaching $11.7 billion by 2031
AGP
Allied Market Research projects the global Bluetooth 5.0 market will grow from $4.2 billion in 2021 to $11.7 billion by 2031, driven by demand for wireless audio, device networking and data transfer.
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